Telcordia Sr-332 Handbook

Posted By admin On 04.08.19

Learn about the most widely accepted Reliability Prediction standards, including MIL-HDBK-217, Telcordia, 217Plus, China's GJB/z 299, and the NPRD and EPRD component databases, and how to choose which one to use.

Telcordia Sr-332 Handbook

Telcordia Electronic Reliability Prediction

The Telcordia Software Module of ITEM ToolKit calculates the reliability prediction of electronic equipment based on the Telcordia (Bellcore) TR-332 and SR-332 standards. These standards use a series of models for various categories of electronic, electrical and electro-mechanical components to predict steady-state failure rates which environmental conditions, quality levels, electrical stress conditions and various other parameters affect. It provides predictions at the component level, system level or project level for COTS (Commercial Off-The-Shelf Parts). The models allow reliability prediction to be performed using three methods for predicting product reliability:

  • Method I: Parts Count
  • Method II: Combines Method I predictions with laboratory data
  • Method III: Predictions based on field data

The Telcordia standard also documents a recommended method for predicting serial system hardware reliability. It contains instructions for suppliers to follow when providing predictions of their device, unit, or serial system reliability. It can also be used directly by telecommunications service providers for product reliability evaluation.

Device and unit failure rate predictions generated using this procedure are applicable for commercial electronic products whose physical design, manufacture, installation, and reliability assurance practices meet the appropriate Telcordia (or equivalent) generic and product-specific requirements.

Features

  • Powerful and user friendly Telcordia telecom standard reliability prediction software
  • Combine prediction methods for complex analysis
  • Optimize designs to meet targeted goals
  • Select components with regard to reliability and cost savings
  • Be more accurate and efficient than with manual methods
  • Take advantage of powerful 'what if' analytical tools
  • Identify weak areas in a system design
  • Build and open multiple systems and projects files
  • Drag and drop components and systems between projects
  • Powerful charting facilities

ITEM ToolKit's Reliability Prediction Modules

ITEM ToolKit contains five modules for performing reliability prediction (MTBF) analysis. These modules conform to MIL-HDBK-217 F Notice 2, Telcordia (Bellcore) TR-332 and SR-332, IEC 62380 (RDF 2000), China 299B GJB/z 299B (electronics) and NSWC 06 (mechanical) and share many common features and capabilities.

Each reliability prediction module is designed to analyse and calculate component, sub system and system failure rates, including Mean Time Between Failure (MTBF), in accordance with the appropriate standard. After the analysis is complete, ITEM ToolKit's integrated environment comes into its own with powerful conversion facilities for transferring data to other modules of the program. For example, transfer your MIL-217 project data to FMECA or your Telcordia project to RBD. These powerful facilities transfer as much of the available information as possible, saving you valuable time and effort.

Telcordia sr 332 examples

ITEM ToolKit's Multi Document Interface allows several projects or libraries to open at the same time. This valuable feature comes in especially handy when it is necessary to transfer data from one project (or library) to another.

Users can construct hierarchical breakdowns of systems with no restrictions on block numbers or levels of indenture. As new sub blocks and components are added, ITEM ToolKit automatically recalculates all dependent failure rates to take account of new information.

Telcordia Sr 332 Issue 4

Powerful global editing facilities are available for performing 'what if' evaluations. 1 this installation cannot be run by directly launching the msi package. These facilities enable you to experiment with temperature, environmental and stress settings and see how your system performance will vary.